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SMT mounter production precautions

Classification:Company news Release time:2024-01-22 504 hits

1, ESD electrostatic protectionElectrost...

1, ESD electrostatic protection


Electrostatic hazard: high voltage breakdown, resulting in scrap of electronic components.


Electrostatic prevention: to enter the workshop to wear anti-static clothing, electrostatic detection; Wear ESD rings and ESD gloves when touching products and components. Ground all tools and machines; Use electrostatic protective table MATS; Report the potential for electrostatic damage immediately.


2. Temperature and humidity control


Requirements: The workshop temperature should be maintained at 25 ° C ±3, and the humidity should be maintained at 50%±20


Objective: High temperature in workshop may cause flux volatilization in solder paste, low temperature solder paste fluidity is poor. The maintenance of humidity in the workshop is to prevent the air dry coal from generating static electricity, and the electronic components will be damp and oxidized if the humidity is too large


3, solder paste back temperature preservation


Requirements: The solder paste should be stored at 2℃-8℃; The solder paste needs to be warmed at room temperature for 4 hours before it can be used


Objective: To ensure the fluidity and activity of solder paste


4, chip, PCB baking


Requirements: Ordinary TRAY type IC baked at 120℃ 8-12 hours, BGA type baked 20-24 hours; PCB baking according to process requirements (generally not baking)


Objective: To remove water vapor in the chip and prevent oxidation during reflux. PCB prevents foaming


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