SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

There are many factors that affect the speed of the placement machine, including the quality and maintenance of the machine itself, the quality of the relevant operation and management personnel, and the choice of the placement program

In fact, the placement machine should not only be fast, but also accurate and stable. In the actual operation process, the standard of each SMT mounting electronic components is different, and the speed is not the same.

For example, the accuracy of LED components is relatively low compared to the accuracy requirements of SMT components, so the speed of LED products is faster than SMT products, because the accuracy requirements of SMT patches are higher than those of LED, the speed of the placement machine equipment in the installation is slower, and the installation efficiency will decline.

1, on the one hand, the suction nozzle of the SMT machine is insufficient vacuum negative pressure, the suction nozzle automatically converts the mechanical valve of the mount head before taking the piece, from blowing to true adsorption, resulting in certain negative pressure, when the suction part, the negative pressure sensor detection value is within a certain range, the machine is normal, and vice versa.

On the other hand, it is due to the dust in the adhesive or external environment, especially the large amount of waste generated after cutting off the components of the paper braid packaging, forming the plug of the patch machine nozzle

2, the error on the setting of the placement machine program will also reduce the installation power of the placement machine, the solution is to increase the training of customers, so that customers can get started faster.

3, the quality of the electronic components themselves, the suction nozzle picks up the installation of electronic components, the pin is not fully attached or directly bent or broken. This situation can only be controlled in the quality of the purchase of mounting components, which will not only affect the mounting power and product quality, the nozzle often sucks and installs such components, but also forms varying degrees of damage, and over time will reduce the service life of the nozzle.

(1) The number of each component on the PCB and the position of the feeder table. These are two factors that affect each other, and with respect to those components that are placed in greater numbers, it is obvious that they should be placed together to minimize movement on the feeder table.

(2) The rotation speed of the turret. The Head Speed is set by the programmer in the component library, which determines how fast the turret can move after picking up the component. The Head Speed depends on the size of the component, the larger the component, the lower the Head Speed, which is to prevent the lack of adsorption of the vacuum nozzle to cause the component to fly out, or to cause the component to shift in the suction mouth to form a position, so the Head Speed setting is limited. The mount speed of MSHG3 can be divided into 8 levels, as shown in Table 1. After the turret picks up a component with a higher Head Speed, all components adsorbed on the turret will move at this speed, regardless of the Part Library Settings. The turret Speed is always determined by the relatively large Head Speed in the picked element. Obviously, it is relatively good for the mounting program not to put components with different Head speeds together, on the one hand, it can prevent the full utilization of Head Speed because of the different Head speeds of components. On the other hand, with regard to the turret, the continuous acceleration or deceleration will also form the extension of the production cycle and the instability of the movement.

(3) The motion of the material on the mounting machine. Because when the feeder switches from one orientation to the adjacent orientation, the feeding table can still adhere to its relatively large speed movement, but when the feeder's orientation switches beyond one, the speed of the feeding table will be reduced by 30% to 50%, and when the program is optimized, the feeding table should be reduced as much as possible between the two feeding tanks that are far apart.

(4) Acceleration and deceleration form of X-Y workbench. When the X-Y table moves from the orientation of the previous component to the orientation of the next component, even if the time is very short, it can be divided into the process of stop-acceleration - relatively large speed - deceleration - stop. The Speed of the X-Y workbench depends on the Head Speed of the Part Library. In the case of MSHG3, when the Head Speed is set to low, the acceleration state of the X-Y workbench will persist regardless of the Part Library Settings of the components placed later. Because of the large or very fine pin IC, the high acceleration method will cause the solder paste can not fix the component and cause the component orientation to shift. Therefore, for components with low Head Speed Settings, it is relatively better to organize them at the back of the program to prevent the interaction of component Settings from leading to longer machine production cycles

(5) Movement interval of X-Y table. This is an important factor that affects the movement of the machine, and it is also an aspect that many optimization software focuses on.

The above five points are the main factors of the speed of the image placement machine, we in the production process by adjusting the placing order of the feeder, the mounting order of the components and other methods to optimize the program to reduce the machine production cycle, improve our production speed, so as to improve the production efficiency of our machine.