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Structure and characteristics of the mounting machine

Classification:Company news Release time:2023-04-19 930 hits

Structure and characteristics of the mou...

Structure and characteristics of the mounting machine


1. Rack


The frame is the foundation of the machine, all the transmission, positioning, and transmission mechanisms are firmly fixed on it, and various feeders are also placed on it, so the frame should have sufficient mechanical strength and rigidity. At present, there are various forms of mounting machines, which can be roughly divided into two categories: integral casting type and steel plate welding type.


2. Transmission mechanism and support platform


The role of the transfer mechanism is to send the PCB that needs to be attached to a predetermined position, and then send it to the next process after the placement is completed. The conveyor is an ultra-thin belt conveyor system placed on the track. Usually the belt is placed on the edge of the track, the belt is divided into A, B, C3 segments, and the PCB clamping mechanism is provided in the transmission part of the B zone, and the infrared sensor is equipped in the A and C zone, the more advanced machine also has a barcode reader, which can identify the entry and send out of the PCB, and record the number of PCB.


3.XY and Z/θ servo positioning system


Function The XY positioning system is the key mechanism of the placement machine, and also the main index to evaluate the accuracy of the placement machine, which includes the XY transmission mechanism and the XY servo system. There are two common ways of working: one is to support the sticker head, that is, the sticker head is installed on the X guide rail, and the X guide rail moves in the Y direction to achieve the whole process of the X and Y direction of the sticker, which is common in the general type of sticker machine (universal machine); The other is to support the PCB bearing platform and realize the PCB moving in the X and Y direction, this type of structure is commonly seen in the mounting machine of the tower rotating head (turret), in this type of high-speed machine, the mounting head only does rotating motion, and relies on the horizontal movement of the feeder and the movement of the PCB bearing plane to complete the mounting process. The XY positioning system belongs to the moving guide rail structure.


4. Optical identification system


After the chip head absorbs the component, the CCD camera images the component, and converts it into a digital image signal, analyzes the geometric size and geometric center of the component by computer, and compares it with the data in the control program, calculates the error between the center of the nozzle and the center of the component in ΔX, ΔY and Δθ, and timely feedback to the control system for correction. Make sure that the component pins coincide with the PCB pad.


5. Tape the title


The chip head is the key part of the chip mounter, which can automatically correct the position under the control of the correction system after picking up the component, and accurately stick the component to the specified position. The development of the sticker head is a sign of the progress of the sticker head, the sticker head has been developed from the early single head and mechanical alignment to the multi-head optical alignment, the following is the type of sticker head.


6. Feeder


The role of the feeder is to provide the chip component SMC/SMD to the patch head in accordance with a certain law and order, so as to accurately and conveniently pick up, it occupies a larger number and position in the patch machine, and is also an important part of the selection of the patch machine and the arrangement of the patch process. With the improvement of SMT speed and accuracy, the design and installation of the feeder have been paid more and more attention in recent years. According to the different SMC/SMD packaging, the feeder usually has several types of Tape, tube, Waffle and bulk material.


7. Sensors


The chip mounter is equipped with a variety of sensors, such as pressure sensors, negative pressure sensors and position sensors. With the improvement of the intelligence of the chip mounter, the performance of components and electrical appliances can be checked and the normal operation of the machine can be monitored at all times. The more sensors are used, the higher the intelligent level of the mounter.


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