SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

Placement machine nozzle:

When the vacuum negative pressure is generated, the nozzle is a part that directly contacts the SMT component, the size of the nozzle hole and the shape of the SMT component have a set of practical nozzle. In order to adapt to the mounting of different components, it is also equipped with an automatic replacement of the nozzle device. There is also an elastic compensation buffer mechanism between the suction nozzle and the straw to ensure the protection of the patch component during the picking process and improve the mounting rate of the component.

Placement machine pneumatic solenoid valve:

The micro pneumatic solenoid of the mounting head is another important component of the mounting head, which manages the functions of moving and picking up. With the development of the mounting machine, the integrated solenoid valve group has also been greatly developed, and some individual solenoid valves are only 10-18 mm thick. And the electromagnet driving power is small, and the driving level of the general circuit can be directly driven.

Title:

The mechanism of the sticker head can work together to install a variety of forms of sensors to effectively coordinate the working state of the patch. When the chip function is determined, the overall structure design of the chip head becomes the key to the chip mounter, the chip head is a high-speed moving component to improve the accuracy must reduce its weight and volume, so the design of a structure with full function of the chip head, is also the design focus of the chip.

Placement machine component pickup:

The picking element is generally the use of vacuum negative pressure suction nozzle to absorb the element, its structure is simple and easy to maintain, in the movement of picking and placing, the suction nozzle to do the Z direction of movement, not only the speed of picking and placing, but also stable. The early Z direction movement of the nozzle was completed by using a micro cylinder, which was found to be easy to wear, short life and loud noise in nearly ten years of use. At present, many new models have chosen a novel electromechanical body drive rod instead, so that the Z motion state can be controlled, greatly improving the comprehensive performance of Z direction movement.

Positioning of mounter components:

The component positioning system of the sticker head is an important part of the quality of the patch, and it is also a technical difficulty in the study of the patch. When the sticker element is absorbed by the component, the component is in a stable suspension state. Early technology with mechanical claw passive positioning, thereby solving the problem of component positioning in the early placement machine, but must be mechanical, mechanical manufacturing errors, directly reflect the quality of component positioning, especially when the placement speed increases, mechanical noise, parts wear and precision life, etc., limit the progress and development of mechanical positioning claw.

Mounter component rotation:

When the suction head holding device moves and positions, most of the components make a quantitative rotation movement (q Angle), first to correct the installation axis of the components on the board and the Angle of the axis of the components in the moving process (q' Angle), the second is to solve the Angle difference between the components on the feeder and the PCB board components of the solder pad axis (q "Angle) q=q'+q". The mechanism for correcting the Angle deviation of the component mounting is controlled by an open-loop stepper motor and operated by a small synchronous belt. Now some novel SMT machines have been replaced by some special micro-motors, so that the performance of the mechanism has been greatly improved. In order to improve the mounting speed of the SMT machine, the combination of multi-nozzle is adopted in the pasting head, and its operating procedures are precisely controlled by the computer.