SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

Components from the high-speed motion of the sticker head, removed from the packaging tape, affixed to the printed board in the process, will produce not taken, lost after absorption and other poor absorption failures, these failures will cause a large number of component losses, according to our experience, component absorption is usually caused by the following reasons:

(1) The vacuum negative pressure is insufficient, when the suction nozzle takes the element, the suction nozzle produces a certain negative pressure, the element is adsorbed on the suction mouth, and the negative pressure detection method is generally used to determine whether the suction nozzle picks up the element is abnormal. When the negative pressure sensor detects the value within a certain range, the machine thinks that the absorption is normal, and the other way is that the absorption is poor. When the component is absorbed, the vacuum negative pressure should be above 53.33kPa, so that there is enough vacuum to absorb the component. If the vacuum negative pressure is insufficient, it will not be able to provide enough suction elements, in use, we should often check the vacuum negative pressure, and regularly clean the nozzle, but also pay attention to the pollution of the vacuum filter element of each mounting head, its role is to filter the air source that reaches the nozzle, and replace the black pollution to ensure the smooth flow of air.

(2) Nozzle wear, nozzle deformation, blockage, damage caused by insufficient air pressure, resulting in suction components, so it is necessary to regularly check the degree of wear of the nozzle, serious replacement.

(3) The influence of the feeder, poor feeding of the feeder (the feeder gear is damaged), the material belt hole is not stuck on the feeder gear, there are foreign bodies under the feeder and the spring wear), the compression belt cover plate, spring and other operating mechanisms cause deformation, rust, etc., resulting in component bias, vertical or unable to absorb the device, so it should be checked regularly and dealt with in time when problems are found. So as not to cause a lot of waste of devices.

(4) The influence of the height of absorption, the ideal height of absorption is to press down 0.05mm when the nozzle touches the surface of the component, if the depth of the pressure is too large, it will cause the component to be pressed in the feed tank but can not take the material. If the absorption of a component is not good, the absorption height can be adjusted slightly upward, such as 0.05mm. In the actual work process, the author has encountered a bad suction of all components on a platform, and the solution is to appropriately move up the extraction height of the platform in the system parameters.

(5) Incoming material problems, some manufacturers produce chip component packaging quality problems, such as the hole spacing error is large, the adhesive force between the paper tape and the plastic film is too large, the size of the tank is too small, etc., are the possible reasons for the components can not be picked up.