SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

Patch machine development stage

1, the first generation of SMT machine

The first generation of SMT mounters is an early mount device in the 1970s to the early 1980s, driven by surface mount technology in industrial and civilian electronic products. Although the mechanical alignment method used by the SMT machine at that time determined that the mounting speed was low (1000 ~ 2000 pieces/hour), the mounting accuracy was not high (X-Y positioning ±0.1mm, the placement accuracy ±0.25mm), and the function was simple, but it already had all the elements of the modern SMT machine, relative to the manual plug-in assembly, Such speed and precision is undoubtedly a profound technological revolution.

The first generation of SMT machine has created a new era of large-scale automatic, high-efficiency and high-quality production of electronic products, and the requirements for the early development of SMT Chip components are relatively large (Chip component type is 1608, IC pitch is 1.27 ~ 0.8mm), which can already meet the needs of mass production. With the continuous development of SMT and the miniaturization of components, this generation of SMT machines has long been withdrawn from the market, and can only be seen in individual small businesses.

2, the second generation of SMT machine

From the mid-1980s to the mid-late 1990s, the SMT industry gradually matured and developed rapidly, driven by it, the second-generation mounter adopted an optical system on the basis of the first-generation mounter, which greatly improved the speed and degree of the mounter and met the needs of the rapid popularity and rapid development of electronic products.

In the process of development, it gradually formed a high-speed machine based on mounting Chip components and emphasizing the mounting speed (also known as Chip component mounting machine or shooting machine), and a multifunctional machine based on mounting various IC and special-shaped components (also known as a general-purpose machine or IC mounting machine) with two significantly different functions and uses.

(1) High-speed machine

The high-speed machine mainly uses a rotary multi-head multi-suction nozzle stick head structure, according to the rotation direction and PCB plane Angle can be divided into turret type (rotation direction and PCB plane parallel) and rotary type (rotation direction and PCB plane vertical or 45°), the relevant content will be discussed in detail in the following chapters.

Due to the use of optical alignment technology and precision mechanical systems (ball screws, linear guides, linear motors and harmonic drivers, etc.), precision vacuum systems, various sensors and computer control technology, the installation speed of high-speed machines has reached the order of 0.06 s/ piece, close to the limit of electromechanical systems.

(2) Multi-function machine

The multi-function chip machine is also known as the universal machine, which can mount a variety of IC package devices and special-shaped components, and can also mount small chip components, which can cover various components of different sizes and shapes, so it is called the multi-function chip machine. The structure of the multifunctional SMT machine mostly adopts the arch structure and the horizontal multi-suction nozzle pasting head, which has the characteristics of high precision and good flexibility. The multi-function machine emphasizes the function and accuracy, and the mounting speed is not as fast as the high-speed mounting machine, which is mainly used for mounting various package ics and large and special-shaped components, and it is also used for the mounting of small chip components in small and medium-sized production and trial production.

With the rapid development of SMT and the further miniaturization of components, and the emergence of more refined SMD packaging forms such as SOP, SOJ, PLCC, QFP, BGA, etc., this generation of SMT mounters has gradually become powerless and has gradually withdrawn from the vision of mainstream SMT mechanism manufacturers, but a large number of second-generation SMT mounters are still in use. Its application and maintenance is still an important topic for SMT equipment.

3, the third generation of placement machine

In the late 1990s, driven by the rapid development of the SMT industry and the diversification of electronic product demand and variety, the third generation of SMT machines developed. On the one hand, the new miniaturization package and 0402 chip components of various ics put forward higher requirements for chip technology; On the other hand, the complexity and installation density of electronic products have further increased, especially the trend of multi-variety and small batch, which promotes the mounting equipment to adapt to the packaging needs of assembly technology.

(1) The main technology of the 3rd generation placement machine

• Modular composite architecture platform;

• High-precision vision systems and flight alignment;

• Double track structure, can work synchronously or asynchronously, improve machine efficiency;

• Multi-arch frame, multi-sticker and multi-nozzle structure;

• Intelligent feeding and testing;

• High-speed, high-precision linear motor drive;

• High speed, flexible, intelligent sticker head;

• Precision control of Z-axis movement and mounting force.

(2) The main characteristics of the third generation of SMT machines - high performance and flexibility

• Combine high-speed machine and multi-function machine into one: With the flexible structure of modular/modular/cellular machine, the functions of high-speed machine and universal machine can be realized on one machine only by selecting different structural units. For example, from 0402 chip components to 50mm×50mm, 0.5mm pitch IC mount range and mount speed of 150,000 cph.

• Both mount speed and accuracy: The new generation of mount machines uses high-performance mount heads, precision visual alignment, high-performance computer hardware and software systems, for example, to achieve 45,000 cph speeds and mount accuracy of 50 μm or more at 4 Sigma on a single machine.

• High efficiency mounting: The actual mounting efficiency of the mounter can reach more than 80% of the ideal value through high performance mounting head and intelligent feeder technology.

• High quality mounting: Accurately measure and control the mounting force through the Z-dimension to make good contact between the components and the solder paste, or apply APC to control the mounting position to ensure better welding results.

• The production capacity per unit site area is 1 to 2 times higher than the second-generation machine.

• Stackable (PoP) assembly is possible • Intelligent software systems, e.g. efficient programming and traceability systems.