SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

SMT processing process:

1. Solder paste printing: Its role is to print the solder paste onto the PCB pad to prepare for the welding of components. The equipment used is the screen printing machine, which is located at the front of the SMT production line.

2. Parts mounting: Its role is to accurately install the surface assembly components to the fixed position of the PCB. The equipment used is the SMT machine, which is located behind the screen printing machine in the SMT production line.

3. Furnace curing: Its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing furnace, which is located behind the SMT machine in the SMT production line.

4. Reflow welding: Its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow furnace, which is located behind the SMT machine in the SMT line.

5. AOI optical inspection: Its role is to detect the welding quality and assembly quality of the assembled PCB board. The equipment used is automatic optical inspection (AOI), the order volume is usually more than ten thousand, and the order volume is small by manual inspection. Location According to the need of detection, it can be configured in the appropriate place of the production line. Some before reflow welding, some after reflow welding.

6. Maintenance: Its role is to repair the PCB board that has detected a fault. The tools used are soldering iron, repair workstation, etc. Configured after AOI optical inspection.

SMT patch processing and production precautions:

1. Test fixture confirmation: Confirm the test fixture and test accessories before production; Collection of previous problem points

2. Special material confirmation: Confirm the abnormal materials before production, a material confirmation

3. First confirmation:

(1) Make a simple understanding and test of the first piece, and check the relevant first piece records

(2) Check whether the previous problem occurs again and whether the hand improves

(3) Confirm whether the SMT patch processing process and technology need to be improved before

4. Analysis and confirmation of defective products

Do a simple analysis of the defective products, understand the main defective distribution and main causes, and try to improve

5. Information feedback

(1)SMT chip processing and production problem points feedback generative machine type responsible person, remind attention

(2) Collect the problem points of assembly in the plant, feedback to the person in charge, and ask for improvement