SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

The basic principle of all SMT machines is the same, and the installation of components is realized through the basic steps of circuit board entry, positioning, component absorption, identification and mounting. With the development of mounting technology, various SMT machine research and development, manufacturers have developed a variety of SMT machines to meet the needs of the market. In addition to the three different stages of development of the SMT machine mentioned earlier, different requirements for different markets, different characteristics of various products, different production characteristics, and different design concepts of equipment manufacturers, the SMT machine can be divided into different types from several aspects such as speed and function.

1. Classification by speed

There is generally no specific limit according to the speed of the placement machine, and according to the habit, it can usually be divided into the following types according to the installation speed of the components.

(1) Medium and low speed patch machine

The theoretical mounting speed of the medium and low speed SMT machine is less than 30,000 pieces /h (chip components).

The medium and low speed Placement Machine is generally referred to as the medium speed placement machine, also known as the Mid-range placement machine. Most of the medium speed mounter adopts the arch structure, which is relatively simple in structure, poor in mounting accuracy, small in footprint, and low in environmental requirements. Generally, the cost is considered in the design and manufacturing, and strive to meet the needs of general consumer electronics manufacturing and general industrial and commercial electronic equipment manufacturing, so that both mounting capacity and cost are equal. Due to the above reasons, the medium speed SMT machine is widely used in some small and medium-sized electronic production and processing enterprises, R & D design centers and production enterprises with multi-variety and small-batch products.

In the early development of surface mount technology, the SMT machine with a SMT speed of more than 14,000 pieces /h can be called a high-speed SMT machine, such as CP2 and TCMV800 machines. With the development of surface mounting technology and automation technology, the speed and accuracy of the placement machine are getting higher and higher, and the division standard of the high-speed placement machine has also improved. The theoretical speed of what is now commonly considered a medium speed SMT machine, such as the AdVantis AC-30L from Global Instruments, has been able to reach 30,000 pieces /h.

There are also some SMT machines mainly used for mounting large components, high-precision components and special-shaped components, and small chip components can also be mounted. This Machine belongs to the Multi-Function Placement Machine in function, but because their theoretical speed is between 3000 and 20000 pieces /h, they are also classified as medium-speed placement machines if they are classified according to speed.

(2) High-speed placement machine

The theoretical mounting speed of the high-speed SMT machine is 30000 ~ 60000 pieces /h.

High-speed SMT machine is mainly used to mount small chip components and small integrated components, and some high-speed machines also have the function of small mount spherical matrix components (BGA). The structure of the high speed SMT machine is more commonly used in the turret structure, but also more in the composite structure. The design of high-speed machine mainly considers the mounting speed and stability, and realizes the high-speed mounting under the accuracy of the micro-chip component mounting. High speed SMT machines are widely used in large electronics manufacturing enterprises and some professional original equipment manufacturing enterprises (Oems).

Like the medium speed SMT machine, with the development of science and technology, the speed of the high-speed SMT machine is getting faster and faster, and the speed of the high-speed SMT machine has also increased from 14,000 pieces /h to nearly 60,000 pieces /h. The design of the SMT machine has also been developed from the main consideration of speed to the consideration of high mounting accuracy, high reliability, multi-function, easy operation and maintenance and rapid replacement of products.

(3) Ultra-high speed SMT machine

The theoretical mounting speed of the ultra-high speed mounter is higher than 60,000 pieces /h.

Ultra-high speed SMT machine is also a higher speed SMT machine developed on the basis of high-speed SMT machine, these SMT machines in addition to mount small chip components and small integrated components, some can also mount spherical matrix components (BGA). In addition, some ultra-high-speed SMT machines are equipped with high-precision multi-function mounting heads, becoming a high-speed multi-function SMT machine that can mount small components at high speed and large high-precision and special-shaped components.

The structure of the ultra-high speed mounting machine generally has two kinds of compound structure and large parallel structure. Earlier examples of ultra-high speed machines were the Assembleon FCM with a large parallel structure and the Siemens HS50 with dual work platforms. In recent years, every major mounter supplier has introduced its own ultra-high speed mounters, such as Universal Genesis and others. The mounting speed of the large parallel ultra-high speed mounter is related to the number of modules, such as a large parallel ultra-high speed mounter can be configured with 20 modules, and the theoretical mounting speed can reach 150,000 pieces /h. The latest hybrid ultra-high speed mounters can also reach theoretical mount speeds of 120,000 pieces /h, such as Universal's Genesis GC-120Q.

2. Classification by function

Some complex electronic products on the circuit board can be assembled by the machine a variety of components, there are common chip components, there are a variety of chip integrated circuits (ics), as well as spherical matrix components (BGA), Connector (Connector), electrolytic capacitors (ALC), indicators and other special-shaped components. Components are also packaged in a variety of ways, including Tape& Reel, Tube, Tray, and Bulk. The mounting range of a single mounting head of the mounting machine is limited, and generally cannot cover all the component ranges (as shown in Figure 2.1) and packaging, so it is not possible to mount small flake components at high speed on a machine or a functional module, but also to mount special-shaped and high-precision components. Therefore, most of the SMT machines can be divided into the following categories according to different functions.

1, high-speed placement machine

The early high-speed SMT machine refers to the shooting machine specially used for chip component mounting, with the development of technology, the concept of high-speed machine is also changing. As mentioned earlier, from the speed of the points, the placement machine can be divided into medium-speed placement machine, high-speed placement machine and ultra-high-speed placement machine; In terms of function, the SMT machine specializing in high-speed mounting of small and medium-sized components is also called high-speed machine, and some medium-speed SMT machines and ultra-high-speed SMT machines specializing in high-speed mounting of small and medium-sized components are also high-speed machines in function.

High speed SMT machine has the following characteristics:

① High-speed machine can be used in various structures. In small and medium-sized production enterprises and scientific research and testing units, the medium speed planing machine is used as a large number of high-speed machines. Turret structure mounting machine used to be the main force of large-scale production of high-speed machines, and now the composite structure and large parallel structure of the mounting machine have a tendency to replace the turret.

② The component mounting range of high-speed machines is generally narrow, the components that can be mounted are generally from 01005 (0.4mm×0.2mm) to 24mm×24mm, and the height of the components is generally up to 6.5mm. Some of the larger components of the high-speed mounting head can only be 5mm ×5mm, and the height can only be 3mm, and then the larger component needs to replace the mounting head with a larger range of mounting components, or skip some of the nozzle when absorbing the component, but the mounting speed will be reduced.

(3) The packaging of components can generally only be packaged in coil and bulk material boxes, and a small number of high-speed SMT machines can accept tube loading and disk loading materials, but some sacrifices will be made in speed.

④ Most of the high-speed mounting heads can be mounted at full speed when absorbing and mounting small components (less than 4mm×4mm). When absorbing and mounting larger components, the speed of rotation is too fast, the rigid contact of the nozzle, the complexity of camera recognition and the insufficient vacuum suction, etc., the speed of component absorption, identification, correction and mounting needs to be slowed down. This affects the productivity of the whole machine.

⑤ The suction nozzle of the high-speed SMT machine generally only has a vacuum suction nozzle.

Most high-speed mounters sacrifice a certain amount of mounting accuracy and function to achieve high-speed mounting. Now the new compound and parallel high-speed SMT machines can take into account the speed and accuracy of mounting.

Most high-speed mounting heads have certain limitations in component recognition, such as correcting most components with recognition shapes, and the detection of BGA balls is not a standard configuration and cannot be "global detection".

Global Instruments has developed a high-speed mounter called Lightning that can be mounted on different AdVantis and Genesis arch platforms to become a high-speed mounter. The component mounting range of this mounting head is from 01005 (0.4mm×0.2mm) to 30mm×30mm, with a height of 6mm, and can absorb materials from the disk loading feeder. The mount head features two mount head mobile cameras with accuracy of 2.9 MPP and 0.9 MPP respectively, with all the features to recognize elements such as BGA, Pattern and C4. Since each nozzle has an independent vacuum system, there is enough suction to grip the components, in the installation of larger components, there is no need to slow down and skip the nozzle, you can mount all the components below the length and width of 30mm and the height of 6mm at full speed

2. Multi-functional patch machine

Multi-Function SMT machine (multi-function) is also called universal machine or high-precision SMT machine, can mount high-precision large, special-shaped components, generally can also mount small chip components, almost can cover all the components range, so it is called multi-function SMT machine, and because the large device packaging pitch is small, the precision of the SMT machine is high. Therefore, it is also called high precision machine.

The features of the multifunctional SMT machine are as follows:

① The structure of the multifunctional mounting machine mostly adopts the arch structure, which has the characteristics of high precision and good flexibility.

② Most of the X and Y positioning systems are driven by full closed-loop servo motors, and direct position feedback is carried out with linear grating encoder to avoid the error of distortion due to screw distortion. Some use double motor and double screw in the Y axis to drive on both sides of the platform, and use bilinear grating ruler for feedback, which can effectively reduce the waiting caused by the stationary mounting head and reduce the error caused by the asynchronous deformation of the beam. There are more advanced linear magnetic levitation motors, in addition to dual drive and other technical characteristics, but also has direct drive, mechanical structure less wear, fast feedback, quiet, easy maintenance and high precision characteristics.

(3) Most of the multi-kinetic energy placement machines use circuit board fixed, and use the movement of the mounting head to achieve X and Y positioning, and will not shift large or heavy components because of inertia because of the movement of the table.

④ Can accept all material packaging methods, such as coil, tube, box and tray. In addition, when the tray is loaded with more materials, multi-layer special tray feeder can be installed.

⑤ In addition to the traditional vacuum nozzle can be used in material absorption, special nozzle can be used for special-shaped components that are difficult to absorb, in addition, pneumatic clamp claws can be used for components that cannot be absorbed with vacuum nozzle (as shown in the figure below).

The component is generally used in the school timing camera, with front light, side light, backlight and online light and other functions, can identify a variety of different components. If the size of the component is too large to exceed one FOV of the camera, the upper camera can also be analyzed and corrected by combining multiple FOV images. The mounting head of some multifunctional mounters is also equipped with a mounting head mobile camera, which can identify smaller components.

in some products, some Pin in Paste components also need to be mounted at the same time as other patch components and be cured by reflow soldering, and the insertion of such punch plug-in components requires the ability of the machine to have a large pressure mount. The mounting head of some multifunctional mounters has the ability of high pressure mounting, and the mounting pressure can be controlled by the program, up to 5 kg.

Some multifunctional SMT machines can be equipped with Flux Dipping Assembly systems, which can be used for component stacking packaging (Package on Package) and Flip Chip mounting.

⑨ Some multi-functional SMT machines can also add decorative glue heads for dispensing before mounting, tinning of some components or Under fill.

With the above characteristics, the multifunctional chip machine can handle a variety of complex components, and is an essential equipment in the production of complex electronic products. In some units of scientific research, testing and trial production, only one or more multi-functional SMT machines are used for small batch production when they can accommodate the types of materials. However, the speed of the multifunctional SMT machine in processing small chip components is far from the speed of the high-speed SMT machine, and some high-speed SMT machines in the installation of small chip components can reach 5 to 10 times the speed of the multi-functional machine in the installation of the same components. Therefore, in medium and large-scale production, reasonable configuration is generally carried out according to the characteristics of the product, so that the efficiency of each equipment is close to higher.

3, high-speed multi-functional placement machine

General SMT machine function is relatively simple, for complex products, must use different functions of the SMT machine combination wiring to complete the entire product mounting. At present, some compound mounters and parallel mounters can install multifunctional mounters or multifunctional modules, so as to realize that small chip components can be mounted at high speed at the same time, and high-precision, large and special-shaped components can be mounted. It can accept almost all component packaging methods, including the addition of disk component feeders.

Some compound mounters with dual mounting platforms can be configured with two beams and two high-speed mounting heads on a mounting platform of the machine, one or two beams on a second mounting platform, a high-speed mounting head and a multi-function mounting head, and can be configured with a multi-disc disc loading feeder. In this way, the SMT machine can not only mount small and medium-sized components at high speed, but also mount large and special-shaped components, becoming a high-speed multi-functional integrated SMT machine.

This structure is more representative of the composite SMT machine has Panasonic CM602C, Siemens HF3 or D3 platform, and global Quadris or Hitachi GXH platform.

② In the rear module of the parallel structure ultra-high speed machine, the mounting head can be used either a general high-speed mounting head or a high-precision mounting head with a suction nozzle. The high-precision mounting head can be mounted with a variety of high-precision and special-shaped components, and a variety of special nozzles and mechanical clamps can be used. In this module, a variety of feeders can be configured, including multi-disc disc loading feeders. This multifunction module, together with the previous high-speed module, becomes a high-speed multifunction production line.

3. Other classification methods

In the classification of the placement machine, there are other classification methods, such as classification according to the structural characteristics of the machine and classification according to the degree of automation of the placement machine process. In addition, in electronic assembly, there are some machines that work in a similar way to the SMT machine, and some can even be cross-used in function, such as semiconductor mounting equipment and multi-function assembly units.

1. Classification by degree of automation

According to the degree of automation to classify, the placement machine can also be divided into automatic placement machine, semi-automatic placement machine and manual placement machine 3 kinds.

At present, most of the SMT machines are fully automatic mechatronics SMT machines, as described in the previous