SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

Technical characteristics of mounting

The rapid and accurate placement of items or machine parts to a specified location is a common process or operating process in various manufacturing and assembly systems in the industrial system. For example, in the semiconductor integrated circuit package, the chip that has been manufactured in the semiconductor packaging technology is removed from the scribing film and placed on the set position on the lead frame or package substrate (substrate) in order to carry out the next lead bonding or other interconnection process, called Die Attaching, which is actually a mounting technology. Because in the packaging technology, the chip shape and picking performance are relatively little changed, the loading process is not the technical key compared with other complex and highly demanding processes, and the loading is usually combined with the bonding unit as a device, so in the packaging technology, the importance of mounting is far less than the assembly technology. However, the two mounting technologies, process requirements and equipment principles are essentially the same, but the loading in the packaging technology is higher than the assembly technology from the equipment degree to the process requirements. In recent years, with the development of high-density and high-precision assembly technology, the boundary between packaging technology and assembly technology has begun to blur, assembly technology has begun to cross fuse with packaging technology, and package-level mounter has begun to be applied to assembly technology.

In terms of the working principle and requirements of the mounting technology itself, it is actually quite simple. The SMC/SMD (surface mount component and Surface mount device) is removed from its packaging and affixed to the specified position of the printed board in a certain manner. However, few other process requirements in industrial systems so far can be compared to the mount technology in SMT. The geometric size and shape of the mount object (SMC/SMD), the range of surface properties and weight, the requirements for mounting speed and mounting accuracy are very different from their working principle.