SuZhou Tonkida Electromechanical Technology Co., Ltd Professional SMT whole line supplier

In reflow soldering of high speed SMT printing devices, the solder paste is used to connect the pins or terminals of the external mount components to the pad. Yamaha SMT machines have many variables. Such as solder paste, screen printing machine, solder paste utilization method and printing process. In the process of printing solder paste, the Yamaha substrate is placed on the table, the machine or vacuum clamp positioning, the positioning pin or vision is used to aim, and the stencil is used to stop the solder paste printing.

In the printing process, the solder paste is actively distributed, the printing scraper is pressed down on the template, and the Samsung chip machine makes the bottom surface of the template fight to the top surface of the circuit board. As the scraper traverses the entire length of the pattern area corrupted, the solder paste is printed onto the pad through the openings in the process template/screen. After the solder paste has accumulated, the screen snaps off immediately after the scraper and returns to the same place.

The metal scraper is made of stainless steel or brass, has a flat blade shape, and utilizes a printing Angle of 30 to 55°. When using higher pressure, it will not dig out the solder paste from the opening hole, and because it is metal, juki placement machines do not wear as easily as rubber scrapers, so they do not need sharpness. They are much more expensive than squeegee boards and can cause formwork wear. Rubber scraper, using 70-90 rubber hardness meter (durometer) hardness scraper. When too much pressure is applied, the solder paste that permeates the bottom of the template can form a tin bridge, requiring frequent bottom wipes. It can even damage the scraper and stencil or wire mesh. The high pressure of the juki SMT machine also tends to dig out the solder paste from the wide opening hole, causing the solder to be insufficient.