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北京SMT basic process composition

Classification:Industry dynamics Release time:2023-02-28 797 hits

SMT basic process elements:Screen printi...

SMT basic process elements:


Screen printing (or dispensing) -- -- -- -- > > pasted on the (curing) -- - > reflow soldering -- -- -- -- > > cleaning test > repair


Screen printing: Its role is to leak the solder paste or patch glue to the solder pad of the PCB to prepare for the welding of the components. The equipment used is a screen printing machine (screen printing machine), located at the front of the SMT production line.


Dispensing: It drops the glue to the fixed position of the PCB, and its main function is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front of the SMT production line or behind the testing equipment.


Mount: Its role is to accurately mount the surface assembly components to the fixed position of the PCB. The equipment used is the SMT machine, which is located behind the screen printing machine in the SMT production line.


Curing: Its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing furnace, which is located behind the SMT machine in the SMT production line.


Reflow welding: Its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow furnace, which is located behind the SMT machine in the SMT line.


Cleaning: Its role is to remove welding residues such as flux that are harmful to the human body on the assembled PCB board. The equipment used is a cleaning machine, the position can not be fixed, can be online, or not online.


Detection: Its role is to detect the welding quality and assembly quality of the assembled PCB board. The equipment used is magnifying glass, microscope, on-line tester (ICT), flying needle tester, automatic optical inspection


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